개요

Automated Production Fusion Bonding System EVG BONDSCALE is designed to fulfill a wide range of fusion/molecular wafer bonding applications, including engineered substrate manufacturing and 3D integration approaches that use layer-transfer processing, such as monolithic 3D (M3D). With BONDSCALE, EVG is bringing wafer bonding to front-end semiconductor processing and helping to address long-term challenges for "More Moore" logic device scaling identified in the International Roadmap for Devices and Systems (IRDS). Incorporating an enhanced edge alignment technology, BONDSCALE provides a significant boost in wafer bond productivity and lower cost of ownership (CoO) compared to existing fusion bonding platforms.