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EVG540 C2W
카테고리
Wafer Bonders개요
EVG®540 Automated Chip-to-Wafer Bonding System Single chamber production bonder up to 300 mm. Dedicated for chip-to-wafer and wafer-to-wafer bond processes. Unique compliant layer system to compensate chips thickness variations.
활성 등재물
0
서비스
검사, 보험, 감정, 물류
상위 등재물
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