CBC200
카테고리
Wafer Bonders개요
Wafer Bonding + Bond Alignment + Cleaning + Metal Oxide Removal + Plasma Activation Up to 200 mm
활성 등재물
3
서비스
검사, 보험, 감정, 물류
Wafer Bonding + Bond Alignment + Cleaning + Metal Oxide Removal + Plasma Activation Up to 200 mm
3
검사, 보험, 감정, 물류