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6" Fab For Sale from Moov - Click Here to Learn More
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6" Fab For Sale from Moov - Click Here to Learn More
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SUSS MicroTec / KARL SUSS SB6 Gen2
    설명
    Temporary Wafer Bonding
    환경 설정
    환경 설정 없음
    OEM 모델 설명
    SB6/8 Gen2 SUSS MicroTec provides a semi-automated platform for multiple bonding processes. Handling wafers up to 200mm as well as various shapes and types of substrates the SB6/8 Gen2 presents itself as a flexible tool for various applications and process environments. The SB6/8 Gen2 is suitable for packaging as well structuring meeting the requirements for MEMS, LED, advanced packaging, 2,5D integration, and 3D integration. SB6 Gen2 - from pieces up to 150mm wafers. Wafer Bonder
    문서

    문서 없음

    SUSS MicroTec / KARL SUSS

    SB6 Gen2

    verified-listing-icon

    검증됨

    카테고리
    Wafer Bonders

    마지막 검증일: 30일 이상 전

    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    103668


    웨이퍼 사이즈:

    알 수 없음


    빈티지:

    2022


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    유사 등재물
    모두 보기
    SUSS MicroTec / KARL SUSS SB6 Gen2

    SUSS MicroTec / KARL SUSS

    SB6 Gen2

    Wafer Bonders
    빈티지: 2022조건: 중고
    마지막 검증일30일 이상 전

    SUSS MicroTec / KARL SUSS

    SB6 Gen2

    verified-listing-icon
    검증됨
    카테고리
    Wafer Bonders
    마지막 검증일: 30일 이상 전
    listing-photo-a32f2499f60944e582eabb0da0967bd6-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/3102/a32f2499f60944e582eabb0da0967bd6/b0af8edbd9714af1af18652f29d4c42f_bonding_mw.jpg
    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    103668


    웨이퍼 사이즈:

    알 수 없음


    빈티지:

    2022


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    설명
    Temporary Wafer Bonding
    환경 설정
    환경 설정 없음
    OEM 모델 설명
    SB6/8 Gen2 SUSS MicroTec provides a semi-automated platform for multiple bonding processes. Handling wafers up to 200mm as well as various shapes and types of substrates the SB6/8 Gen2 presents itself as a flexible tool for various applications and process environments. The SB6/8 Gen2 is suitable for packaging as well structuring meeting the requirements for MEMS, LED, advanced packaging, 2,5D integration, and 3D integration. SB6 Gen2 - from pieces up to 150mm wafers. Wafer Bonder
    문서

    문서 없음

    유사 등재물
    모두 보기
    SUSS MicroTec / KARL SUSS SB6 Gen2

    SUSS MicroTec / KARL SUSS

    SB6 Gen2

    Wafer Bonders빈티지: 2022조건: 중고마지막 검증일:30일 이상 전