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XBS200
카테고리
Wafer Bonders개요
The universal XBS200 platform allows for aligned wafer bonding of wafer sizes up to 200 mm. Its versatility and modular design offer maximum process flexibility in all permanent bonding tasks. A novel aligned wafer transfer method eliminates the complexity of traditional systems and offers consistent process results with excellent system availability. The XBS200 platform offers low cost of ownership for high-volume production of MEMS, LED and 3D advanced packaging. Wafer Bonder
활성 등재물
0
서비스
검사, 보험, 감정, 물류
상위 등재물
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