Machining of compounds such as silicon wafers, SiC wafers, GaN, GaAs, LT, An, etc.
Wafer size: 4-8"

Semiconductor manufacturing equipment: Probing machines, Dicing machines, Precision Blade, Polish grinders, Chemical mechanical planarizers (CMPs), Wafer slicing machines*, Wafer edge grinding machines*
Measuring instruments: Coordinate measuring machines, Surface texture and contour measuring instruments, Roundness and cylindrical profile measuring instruments, Optical measuring instrument, Machine control gauges*, Various types of sensors*



6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

W-GM-4200E-48

카테고리

개요

활성 등재물

서비스

상위 등재물

Moov에 등재하고 즉시 완벽한 구매자를 찾으십시오.