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카테고리
Wafer Grinding개요
The machine is suitable for chamfering of squared mono- or multi crystalline silicon work pieces in the format of 125 x 125 mm and 156 x 156 mm with two parallelly arranged grinding aggregates (2x combined pre- and fine grinding). Work piece lengths of 180 up to 1000 mm can be processed.
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서비스
검사, 보험, 감정, 물류
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