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72/855
카테고리
Wafer Grinding개요
The 72/855 is suitable for grinding of the lateral surfaces of squared mono- and multi crystalline silicon work pieces in the format 125 x 125 mm and 156 x 156 mm, with four parallelly arranged grinding aggregates (2x pre- and 2x fine grinding). Work piece lengths of 180 up to 500 mm can be processed.
활성 등재물
0
서비스
검사, 보험, 감정, 물류
상위 등재물
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