72/865
카테고리
Wafer Grinding개요
The machine is suitable for grinding lateral surfaces and chamfering squared multi crystalline silicon work pieces in the format 125 x 125 mm and 156 x 156 mm, with four parallelly arranged grinding aggregates (2x pre- and 2x fine grinding). Work piece lengths of 180 up to 550 mm can be processed.
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서비스
검사, 보험, 감정, 물류
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