RG608
카테고리
Wafer Grinding개요
This machine is suitable for grinding SiC ingots of 4 -12“ with a max. length of 600 mm and straight notch and Flat grinds. Centering of parts is done automatically.
활성 등재물
0
서비스
검사, 보험, 감정, 물류
상위 등재물
- 제품을 찾을 수 없음
This machine is suitable for grinding SiC ingots of 4 -12“ with a max. length of 600 mm and straight notch and Flat grinds. Centering of parts is done automatically.
0
검사, 보험, 감정, 물류