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UH-I-8800

카테고리
Wafer Grinding
개요

Edge grinder for 4" to 8" substrate, which enables accurate direction of orientation flat. UH-I-8800 is a high throughput model by 2 axes of grinding wheels. -2 cassettes, C-to-C handling -UH-I-8800 is high performance model with 2 axes grinding wheels.

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