설명
설명 없음환경 설정
AMAT Producer_GT(CVD), Vecco, ASM, VarianOEM 모델 설명
The PRI Automation MagnaTran 8 QuadraFly is an advanced robotic system designed for high-precision wafer handling in a vacuum environment. It features SCARA arm technology and direct drive robotics, allowing the simultaneous exchange of four wafers within a compact swing diameter. The QuadraFly robot's patented tri-axial drive enables it to handle heavier payloads, making it suitable for various applications such as Flip Chip, WLCSP, BDA's, MEMS, GaAS, Laser Bars, and bare silicon. The direct magnetic drive technology enhances reliability by reducing the number of parts and eliminating the need for dynamic seals, leading to fewer failures and improved positional repeatability. This system offers efficient and precise wafer handling with minimized vibration, particle generation, and backlash, making it an ideal choice for semiconductor manufacturing processes.문서
문서 없음
BROOKS / PRI AUTOMATION
MAGNATRAN 8
검증됨
카테고리
Wafer Handling
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
115905
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
BROOKS / PRI AUTOMATION
MAGNATRAN 8
카테고리
Wafer Handling
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
115905
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
AMAT Producer_GT(CVD), Vecco, ASM, VarianOEM 모델 설명
The PRI Automation MagnaTran 8 QuadraFly is an advanced robotic system designed for high-precision wafer handling in a vacuum environment. It features SCARA arm technology and direct drive robotics, allowing the simultaneous exchange of four wafers within a compact swing diameter. The QuadraFly robot's patented tri-axial drive enables it to handle heavier payloads, making it suitable for various applications such as Flip Chip, WLCSP, BDA's, MEMS, GaAS, Laser Bars, and bare silicon. The direct magnetic drive technology enhances reliability by reducing the number of parts and eliminating the need for dynamic seals, leading to fewer failures and improved positional repeatability. This system offers efficient and precise wafer handling with minimized vibration, particle generation, and backlash, making it an ideal choice for semiconductor manufacturing processes.문서
문서 없음