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STRASBAUGH 6DS-SP
  • STRASBAUGH 6DS-SP
  • STRASBAUGH 6DS-SP
  • STRASBAUGH 6DS-SP
설명
Multi-Process CMP
환경 설정
환경 설정 없음
OEM 모델 설명
6DS-SP CMP system, a game-changer for high-volume production environments that crave efficiency and precision. Armed with two wafer carriers and dual tables, this system effortlessly accommodates wafer sizes ranging from 100mm to 200mm. A standout feature is its sophisticated motor current endpoint, providing real-time feedback for unprecedented accuracy and control. The innovative multi-zoned ViPRR carriers contribute to its superiority, enhancing wafer handling and boosting process consistency. Where this system truly shines is in its performance capabilities. For 200mm Oxide CMP, it boasts an impressive WIW Uniformity of less than 5% 1 sigma, and a minimal edge exclusion of just 3mm, ensuring a meticulous yield. The 6DS-SP is not merely limited to Oxide applications but extends its prowess to W, AITiC, SOI, and PolySi domains, offering unparalleled flexibility. Equip your production line with the 6DS-SP CMP system, where advanced technology meets unmatched versatility.
문서

문서 없음

카테고리
Wafer Polishing

마지막 검증일: 30일 이상 전

주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

56715


웨이퍼 사이즈:

8"/200mm


빈티지:

알 수 없음


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기

STRASBAUGH

6DS-SP

verified-listing-icon
검증됨
카테고리
Wafer Polishing
마지막 검증일: 30일 이상 전
listing-photo-7f64403faaaa498eb236ae0fdd5a6294-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

56715


웨이퍼 사이즈:

8"/200mm


빈티지:

알 수 없음


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Multi-Process CMP
환경 설정
환경 설정 없음
OEM 모델 설명
6DS-SP CMP system, a game-changer for high-volume production environments that crave efficiency and precision. Armed with two wafer carriers and dual tables, this system effortlessly accommodates wafer sizes ranging from 100mm to 200mm. A standout feature is its sophisticated motor current endpoint, providing real-time feedback for unprecedented accuracy and control. The innovative multi-zoned ViPRR carriers contribute to its superiority, enhancing wafer handling and boosting process consistency. Where this system truly shines is in its performance capabilities. For 200mm Oxide CMP, it boasts an impressive WIW Uniformity of less than 5% 1 sigma, and a minimal edge exclusion of just 3mm, ensuring a meticulous yield. The 6DS-SP is not merely limited to Oxide applications but extends its prowess to W, AITiC, SOI, and PolySi domains, offering unparalleled flexibility. Equip your production line with the 6DS-SP CMP system, where advanced technology meets unmatched versatility.
문서

문서 없음

유사 등재물
모두 보기