Asscon VP1000-53 Vapor Phase Semiautomated process of PCB max. size 610x610mm In-feed with Work-Piece Carrier and a variety of assemblies advantages, Economical soldering system for highest technological requirements Oxidation-free pre-heat and soldering process Homogeneous temperature distribution on the whole assembly Overheating of the solder product is impossible No shadowing or color selectivity
Reproducible process conditions No time-consuming generation of temperature profiles Low operating costs Universally useable for series and individual operation

The goal is to develop and produce advanced and innovative vapor phase reflow soldering systems and to offer our customers a simple and high quality soldering process in the process. Vapor as an energy transfer medium is one of the most effective methods for heating assemblies. The efficiency is many times higher than, for example, heating by convection.

ASSCON

VP1000-53

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ASSCON

VP1000-53

Wave / Vapor / Selective Soldering

유사 등재물

ASSCON

VP1000-53

VP1000-53

Wave / Vapor / Selective Soldering

유사 등재물

ASSCON

VP1000-53