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The Spin Etcher 201 is a single wafer etching machine that can chemically etch one side of a wafer without damaging the other. It can handle 6" to 8" wafers and use up to three different chemicals in one process cycle. The system is fully automatic, with a cassette-to-cassette handling system, and has a flexible control system. It also has a minimized clean room footprint due to its Through-the-wall design.