설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The SEZ 323 is a spin-processing system designed for high throughput cleaning and film removal applications for 300 mm semiconductor wafer processing. It has a robot on a linear tracking system that transports wafers from four cassettes to two identical process chambers that can apply up to three chemicals each. The system has a SEMATECH-compliant graphical user interface and touch screen, and offers options such as a retrofit kit for processing 200 mm wafers, a rinse and dry module, endpoint detection, and more. It supports applications such as cleaning, etching, backside etch & clean, silicon substrate etch, and wafer reclaim.문서
문서 없음
LAM RESEARCH / SEZ
SP323
검증됨
카테고리
Wet Etch
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Refurbished
작동 상태:
알 수 없음
제품 ID:
65019
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
LAM RESEARCH / SEZ
SP323
카테고리
Wet Etch
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Refurbished
작동 상태:
알 수 없음
제품 ID:
65019
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The SEZ 323 is a spin-processing system designed for high throughput cleaning and film removal applications for 300 mm semiconductor wafer processing. It has a robot on a linear tracking system that transports wafers from four cassettes to two identical process chambers that can apply up to three chemicals each. The system has a SEMATECH-compliant graphical user interface and touch screen, and offers options such as a retrofit kit for processing 200 mm wafers, a rinse and dry module, endpoint detection, and more. It supports applications such as cleaning, etching, backside etch & clean, silicon substrate etch, and wafer reclaim.문서
문서 없음