The Saqua series of 300 mm single-wafer cleaning system utilizes single wafer, precisely controlled spin-spray wet cleaning technology to remove a variety of post metal etch particles and byproducts. The Saqua can be configured with up to eight independent process chambers designed for cleaning feature sizes as small as 14 nm. 

Akrion focuses on multiple wet process solutions for semiconductor applications where high yield and low cost of ownership is a challenge. Each process step in device manufacturing presents an opportunity for contamination, which can result in defect formation and device failure, therefore critical cleaning is an integral part of our equipment’s capabilities.

SAQUA

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