설명
설명 없음환경 설정
Config: 2f2d Chamber A Process : Wafer surface clean Chuck : Vacuum Chuck SPRAY : Soft Spray N2 10~100NL/min Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ Spin DRY : 3000rpm Spin Dry only Chamber B Process : Wafer surface clean Chuck : Vacuum Chuck SPRAY : Soft Spray N2 10~100NL/min Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ Spin DRY : 3000rpm Spin Dry only Chamber C Process : Wafer Backside clean Chuck : Mechanical Chuck SPRAY : None Burush : PVA Burush Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ Spin DRY : 2400rpm Spin Dry only Chamber D Process : Wafer Backside clean Chuck : Mechanical Chuck SPRAY : None Burush : PVA Burush Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ Spin DRY : 2400rpm Spin Dry only Software Version (include revision #) V242B000 System Power Rating 208AC 3-phase Loading Configuration 3 load ports Vendor Chm Model Chemicals / Gases Used (not to use Micron Proprietary names) U03 SS(Surface) CO2Water U04 SS(Surface) CO2Water U05 SSR(Backside) CO2Water U06 SSR(Backside) CO2WaterOEM 모델 설명
Wafer Scrubber문서
문서 없음
SCREEN / DNS / DAINIPPON SCREEN
SS-3000-AR
검증됨
카테고리
Wet processing
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
47697
웨이퍼 사이즈:
12"/300mm
빈티지:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
SCREEN / DNS / DAINIPPON SCREEN
SS-3000-AR
검증됨
카테고리
Wet processing
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
47697
웨이퍼 사이즈:
12"/300mm
빈티지:
2006
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
Config: 2f2d Chamber A Process : Wafer surface clean Chuck : Vacuum Chuck SPRAY : Soft Spray N2 10~100NL/min Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ Spin DRY : 3000rpm Spin Dry only Chamber B Process : Wafer surface clean Chuck : Vacuum Chuck SPRAY : Soft Spray N2 10~100NL/min Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ Spin DRY : 3000rpm Spin Dry only Chamber C Process : Wafer Backside clean Chuck : Mechanical Chuck SPRAY : None Burush : PVA Burush Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ Spin DRY : 2400rpm Spin Dry only Chamber D Process : Wafer Backside clean Chuck : Mechanical Chuck SPRAY : None Burush : PVA Burush Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ Spin DRY : 2400rpm Spin Dry only Software Version (include revision #) V242B000 System Power Rating 208AC 3-phase Loading Configuration 3 load ports Vendor Chm Model Chemicals / Gases Used (not to use Micron Proprietary names) U03 SS(Surface) CO2Water U04 SS(Surface) CO2Water U05 SSR(Backside) CO2Water U06 SSR(Backside) CO2WaterOEM 모델 설명
Wafer Scrubber문서
문서 없음