MP100
카테고리
Wet processing개요
Base and precious metals plating Copper flash plate, panel plate, pattern plate Developing, etching, stripping Chemical cleaning Repeatable performance with high Cpk Thickness uniformity to +/-5% Current density to 10ASD Homogeneous plating with no layer separation Eliminates plating voids and pits resulting from trapped gases
활성 등재물
0
서비스
검사, 보험, 감정, 물류
상위 등재물
- 제품을 찾을 수 없음