설명
Batch Wafer Processing Application: Pre Diffusion Clean Damaged / Missing parts: IPA Detect Sensor damage SPM Bath damage환경 설정
Bath-1: SPM Operating: 110 - 150°C, H2SO4/H2O2 (3:1), circulation Chemical spiking: auto concentration feedback Bath Material: Quartz Bath-2: QDR (hot) Operating: DIW rinse (75°C, 40 – 80 L/min) Bath Material: PTFE Megasonic: 950 kHz, 2400W (600*4) Bath-3: APM Operating: 35 - 85°C, NH4OH/H2O2/DIW (1:1:15), 15 L/min, circulation Chemical spiking: auto concentration feedback Bath Material: PTFE Megasonic: 950 kHz, 2400W (600*4) Bath-4: POU Operating: 70°C, NH4OH/H2O2 DIW Shower (hot / cold) Bath Material: PTFE Megasonic: 950 kHz, 2400W (600*4) Bath-5: HPM Operating: 35 - 80°C, HCL/H2O2/DIW (1:1:5) Bath Material: Quartz Bath-6: QDR (hot) Operating: DIW rinse (75°C, 40 – 80 L/min) Bath Material: PTFE Megasonic: 950 kHz, 2400W (600*4) Dryer: SD2 Operating: 49% DHF (1:200), IPA/N2 200°C, 100 L/min Resistivity monitoring (Horiba) Bath Material: PTFEOEM 모델 설명
The EXPEDIUS™ + is designed for 45nm and beyond technology node and has improved upon its predecessor in both performance and productivity. The configuration of the chemical treatment tanks, pure water rinse tanks, and dryer has been optimized to support FEOL clean, which requires particularly stringent process performance. Standard installation of the new SD2 dryer enables significant reduction of 45nm size or less micro-particles. The new SD2 which has been improved from TEL's original IPA dry module decreases the surface tension and prevents pattern destruction of vulnerable structures on the wafer. Furthermore the EXPEDIUS™ + provides high throughput and excellent productivity through a new wafer transportation system with smaller footprint. In addition, its unique batch-formation software option enhances process efficiency regardless of wafer quantity and processing position.문서
문서 없음
카테고리
Wet Benches - Auto
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
21524
웨이퍼 사이즈:
12"/300mm
빈티지:
2007
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
TEL / TOKYO ELECTRON
EXPEDIUS +
카테고리
Wet Benches - Auto
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
21524
웨이퍼 사이즈:
12"/300mm
빈티지:
2007
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Batch Wafer Processing Application: Pre Diffusion Clean Damaged / Missing parts: IPA Detect Sensor damage SPM Bath damage환경 설정
Bath-1: SPM Operating: 110 - 150°C, H2SO4/H2O2 (3:1), circulation Chemical spiking: auto concentration feedback Bath Material: Quartz Bath-2: QDR (hot) Operating: DIW rinse (75°C, 40 – 80 L/min) Bath Material: PTFE Megasonic: 950 kHz, 2400W (600*4) Bath-3: APM Operating: 35 - 85°C, NH4OH/H2O2/DIW (1:1:15), 15 L/min, circulation Chemical spiking: auto concentration feedback Bath Material: PTFE Megasonic: 950 kHz, 2400W (600*4) Bath-4: POU Operating: 70°C, NH4OH/H2O2 DIW Shower (hot / cold) Bath Material: PTFE Megasonic: 950 kHz, 2400W (600*4) Bath-5: HPM Operating: 35 - 80°C, HCL/H2O2/DIW (1:1:5) Bath Material: Quartz Bath-6: QDR (hot) Operating: DIW rinse (75°C, 40 – 80 L/min) Bath Material: PTFE Megasonic: 950 kHz, 2400W (600*4) Dryer: SD2 Operating: 49% DHF (1:200), IPA/N2 200°C, 100 L/min Resistivity monitoring (Horiba) Bath Material: PTFEOEM 모델 설명
The EXPEDIUS™ + is designed for 45nm and beyond technology node and has improved upon its predecessor in both performance and productivity. The configuration of the chemical treatment tanks, pure water rinse tanks, and dryer has been optimized to support FEOL clean, which requires particularly stringent process performance. Standard installation of the new SD2 dryer enables significant reduction of 45nm size or less micro-particles. The new SD2 which has been improved from TEL's original IPA dry module decreases the surface tension and prevents pattern destruction of vulnerable structures on the wafer. Furthermore the EXPEDIUS™ + provides high throughput and excellent productivity through a new wafer transportation system with smaller footprint. In addition, its unique batch-formation software option enhances process efficiency regardless of wafer quantity and processing position.문서
문서 없음