설명
Wire bonding machine환경 설정
환경 설정 없음OEM 모델 설명
"Introducing the Model 360 large wire bonder, a cutting-edge system designed to enhance your productivity. With an impressive bonding rate of 70 bonds per minute, it outperforms previous systems by increasing throughput by 25%. Despite its powerful capabilities, this wire bonder boasts compact dimensions, measuring only 60cm (W) x 105cm (D) x 182cm (H). Equipped with a deep access bond head and an exclusive pattern recognition system, the Model 360C system automates the bonding process for a wide range of electronic packages. Whether you require aluminum or copper wire measuring 125 to 650 um, this system has you covered. Thanks to its computer-controlled four-axis bond head, you can easily bond various types of modules, lead frames, and hybrid substrates. The travel lengths are 6 inches (x direction), 10 inches (Y direction), and 2 inches (Z direction), ensuring flexibility in your bonding operations. Furthermore, the Model 360 large wire bonder ensures exceptional precision, with bond head positioning accuracy within 1um. Trust in this advanced system to optimize your productivity and streamline your electronic bonding tasks."문서
문서 없음
KULICKE & SOFFA / ORTHODYNE
M360C
검증됨
카테고리
Wire / Wedge / Ball Bonder
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
67527
웨이퍼 사이즈:
알 수 없음
빈티지:
2003
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
KULICKE & SOFFA / ORTHODYNE
M360C
카테고리
Wire / Wedge / Ball Bonder
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
67527
웨이퍼 사이즈:
알 수 없음
빈티지:
2003
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Wire bonding machine환경 설정
환경 설정 없음OEM 모델 설명
"Introducing the Model 360 large wire bonder, a cutting-edge system designed to enhance your productivity. With an impressive bonding rate of 70 bonds per minute, it outperforms previous systems by increasing throughput by 25%. Despite its powerful capabilities, this wire bonder boasts compact dimensions, measuring only 60cm (W) x 105cm (D) x 182cm (H). Equipped with a deep access bond head and an exclusive pattern recognition system, the Model 360C system automates the bonding process for a wide range of electronic packages. Whether you require aluminum or copper wire measuring 125 to 650 um, this system has you covered. Thanks to its computer-controlled four-axis bond head, you can easily bond various types of modules, lead frames, and hybrid substrates. The travel lengths are 6 inches (x direction), 10 inches (Y direction), and 2 inches (Z direction), ensuring flexibility in your bonding operations. Furthermore, the Model 360 large wire bonder ensures exceptional precision, with bond head positioning accuracy within 1um. Trust in this advanced system to optimize your productivity and streamline your electronic bonding tasks."문서
문서 없음