The Eagle 60 is a wire bonder from ASM that is capable of ultra-fine pitch bonding for advanced ball grid array (BGA) devices.

ASM is a supplier of semiconductor process equipment for wafer processing, including lithography, deposition, ion implant and single-wafer epitaxy. ASM is part of the ASM International NV group that also includes ASM Pacific Technology (ASMPT). ASMPT, in which ASMI holds a substantial ownership is a leading supplier of semiconductor process equipment for wafer assembly and packaging, and for surface mount technology.



EAGLE 60

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6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

EAGLE 60

카테고리

개요

활성 등재물

서비스

상위 등재물

ASM

EAGLE 60

ASM

EAGLE 60

ASM

EAGLE 60

ASM

EAGLE 60

Moov에 등재하고 즉시 완벽한 구매자를 찾으십시오.

ASM

EAGLE 60

ASM

EAGLE 60

ASM

EAGLE 60

ASM

EAGLE 60