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5810
개요
An ultrasonic ball-wedge bonder for gold wire in the thin wire range and is designed for wire bonds from17 μm and 50 μm (0.7 mil to 2 mil) in thickness. The graphical user interface ensures easy, intuitive access to a multitude of machine and application parameters. The operations for program preparation are conducted interactively, which enables safe operation and higher productivity. Wire Bonder
활성 등재물
0
서비스
검사, 보험, 감정, 물류
상위 등재물
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