AT Premier
개요
The AT Premier is targeted for gold-to-gold interconnect in the growing flip chip market. With industry leading speed and technology, the machine lowers the cost of ownership for stud bumping, enabling a wider range of applications than previously served.
활성 등재물
44
서비스
검사, 보험, 감정, 물류
KULICKE & SOFFA (K&S)
AT Premier
Wire / Wedge / Ball Bonder빈티지: 조건: 중고마지막 검증일18일 전KULICKE & SOFFA (K&S)
AT Premier
Wire / Wedge / Ball Bonder빈티지: 조건: 중고마지막 검증일18일 전KULICKE & SOFFA (K&S)
AT Premier
Wire / Wedge / Ball Bonder빈티지: 조건: 중고마지막 검증일18일 전KULICKE & SOFFA (K&S)
AT Premier
Wire / Wedge / Ball Bonder빈티지: 조건: 중고마지막 검증일18일 전
KULICKE & SOFFA (K&S)
AT Premier
Wire / Wedge / Ball Bonder빈티지: 조건: 중고마지막 검증일18일 전KULICKE & SOFFA (K&S)
AT Premier
Wire / Wedge / Ball Bonder빈티지: 조건: 중고마지막 검증일18일 전KULICKE & SOFFA (K&S)
AT Premier
Wire / Wedge / Ball Bonder빈티지: 조건: 중고마지막 검증일18일 전KULICKE & SOFFA (K&S)
AT Premier
Wire / Wedge / Ball Bonder빈티지: 조건: 중고마지막 검증일18일 전