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설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The UTC-1000 Super wire bonder is a high-speed wire bonder that is compatible with SiP including stacked CSP. It is designed for bonding CSP, BGA, Small Substrate, and Lead Frame Type ICs. The UTC-1000 Super wire bonder is equipped with Shinkawa RPS technology, which is the world’s first capillary tip position closed-loop control that solves fine-pitch bonding misalignment and supports 40μm pad-pitch bonding. The Shinkawa NRS technology reduces vibration that hinders fine-pitch bonding and ensures stable bondability. The UTC-1000 Super wire bonder has various loop modes that are ideal for bonding stacked dies as standard. It also has numerous automatic functions that reduce the burden on the operator문서
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SHINKAWA
UTC 1000 SUPER
검증됨
카테고리
Wire / Wedge / Ball Bonder
마지막 검증일: 어제
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
118828
웨이퍼 사이즈:
8"/200mm
빈티지:
2007
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
SHINKAWA
UTC 1000 SUPER
카테고리
Wire / Wedge / Ball Bonder
마지막 검증일: 어제
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
118828
웨이퍼 사이즈:
8"/200mm
빈티지:
2007
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The UTC-1000 Super wire bonder is a high-speed wire bonder that is compatible with SiP including stacked CSP. It is designed for bonding CSP, BGA, Small Substrate, and Lead Frame Type ICs. The UTC-1000 Super wire bonder is equipped with Shinkawa RPS technology, which is the world’s first capillary tip position closed-loop control that solves fine-pitch bonding misalignment and supports 40μm pad-pitch bonding. The Shinkawa NRS technology reduces vibration that hinders fine-pitch bonding and ensures stable bondability. The UTC-1000 Super wire bonder has various loop modes that are ideal for bonding stacked dies as standard. It also has numerous automatic functions that reduce the burden on the operator문서
문서 없음