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SHINKAWA UTC 1000 SUPER
  • SHINKAWA UTC 1000 SUPER
  • SHINKAWA UTC 1000 SUPER
  • SHINKAWA UTC 1000 SUPER
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The UTC-1000 Super wire bonder is a high-speed wire bonder that is compatible with SiP including stacked CSP. It is designed for bonding CSP, BGA, Small Substrate, and Lead Frame Type ICs. The UTC-1000 Super wire bonder is equipped with Shinkawa RPS technology, which is the world’s first capillary tip position closed-loop control that solves fine-pitch bonding misalignment and supports 40μm pad-pitch bonding. The Shinkawa NRS technology reduces vibration that hinders fine-pitch bonding and ensures stable bondability. The UTC-1000 Super wire bonder has various loop modes that are ideal for bonding stacked dies as standard. It also has numerous automatic functions that reduce the burden on the operator
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SHINKAWA

UTC 1000 SUPER

verified-listing-icon

검증됨

카테고리
Wire / Wedge / Ball Bonder

마지막 검증일: 17일 전

주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

118812


웨이퍼 사이즈:

8"/200mm


빈티지:

2006


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기

SHINKAWA

UTC 1000 SUPER

verified-listing-icon
검증됨
카테고리
Wire / Wedge / Ball Bonder
마지막 검증일: 17일 전
listing-photo-eda6e00b4ad246d7beb0cbc30bba4620-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

118812


웨이퍼 사이즈:

8"/200mm


빈티지:

2006


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음
환경 설정
환경 설정 없음
OEM 모델 설명
The UTC-1000 Super wire bonder is a high-speed wire bonder that is compatible with SiP including stacked CSP. It is designed for bonding CSP, BGA, Small Substrate, and Lead Frame Type ICs. The UTC-1000 Super wire bonder is equipped with Shinkawa RPS technology, which is the world’s first capillary tip position closed-loop control that solves fine-pitch bonding misalignment and supports 40μm pad-pitch bonding. The Shinkawa NRS technology reduces vibration that hinders fine-pitch bonding and ensures stable bondability. The UTC-1000 Super wire bonder has various loop modes that are ideal for bonding stacked dies as standard. It also has numerous automatic functions that reduce the burden on the operator
문서

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유사 등재물
모두 보기