설명
ALD (Atomic Layer Deposition)환경 설정
환경 설정 없음OEM 모델 설명
The ASM EAGLE XP is an advanced wire bonder machine manufactured by ASM Assembly Systems, a division of ASM Pacific Technology. Wire bonding is a key process in semiconductor packaging that involves connecting integrated circuits (ICs) or other semiconductor devices to the package leads or interconnects using fine wires.문서
문서 없음
ASM
EAGLE XP
카테고리
ALD
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
23230
웨이퍼 사이즈:
12"/300mm
빈티지:
2012
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
ALD (Atomic Layer Deposition)환경 설정
환경 설정 없음OEM 모델 설명
The ASM EAGLE XP is an advanced wire bonder machine manufactured by ASM Assembly Systems, a division of ASM Pacific Technology. Wire bonding is a key process in semiconductor packaging that involves connecting integrated circuits (ICs) or other semiconductor devices to the package leads or interconnects using fine wires.문서
문서 없음