설명
2010 ASM Eagle XP5 PEALD환경 설정
Tool Status: Deinstalled and crated and in storage. (March 2023) Wafer Size 300 mm Process PE-ALD System Software Version Eagle I ASMJ software (Windows embedded XP / OS) See the configuration file below to download along with other documents. Full set of schematics available on request. Process PE-ALD Oxide, HT-SiO/HT-SiN Hardware Configuration (fab): Main System ASM PE-ALD System Mainframe 1 Handler System FI: Kawasaki / Vac: JEL 1 Factory Interface FOUP 2 Options System Others Process Chamber (RC3 / RC4) 2 Hardware Configuration (subfab/ auxiliary units): Power Rack 1 Notes The ASM Eagle is like new. It was never used in Production and only used to test wafers. One chamber had a throttle valve issue and RF Gen issue. The RF Gen was replaced but they did not replace the throttle valve so only one chamber was used to test the wafers. The liquid gas panel was not used. There are 2 spare MFCs included. Are you in need of a high-precision, reliable tool for creating thin film coatings on your semiconductor substrates? Look no further than the 2010 ASM Eagle XP5 PEALD system! This advanced machine utilizes plasma-enhanced atomic layer deposition (PEALD) technology to create ultra-thin, uniform coatings on a variety of substrate materials. It is capable of producing coatings with exceptional uniformity and reproducibility, making it ideal for a wide range of applications in the semiconductor industry. The ASM Eagle XP5 is a versatile tool that can be used to deposit a wide range of materials, including metals, oxides, and other compounds. It is also capable of operating at a range of process pressures and temperatures, making it suitable for use in a variety of manufacturing environments. In addition to its impressive coating capabilities, the ASM Eagle XP5 is also built with durability and ease of maintenance in mind. It has a robust design and is backed by ASM's reputation for producing high-quality, reliable equipment. Don't miss out on this opportunity to add a powerful, flexible thin film coating system to your manufacturing arsenal. Purchase the 2010 ASM Eagle XP5 PEALD today and take your semiconductor production to the next level!OEM 모델 설명
Plasma enhanced atomic layer deposition문서
문서 없음
ASM
EAGLE XP5
카테고리
ALD
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
120626
웨이퍼 사이즈:
알 수 없음
빈티지:
2010
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
2010 ASM Eagle XP5 PEALD환경 설정
Tool Status: Deinstalled and crated and in storage. (March 2023) Wafer Size 300 mm Process PE-ALD System Software Version Eagle I ASMJ software (Windows embedded XP / OS) See the configuration file below to download along with other documents. Full set of schematics available on request. Process PE-ALD Oxide, HT-SiO/HT-SiN Hardware Configuration (fab): Main System ASM PE-ALD System Mainframe 1 Handler System FI: Kawasaki / Vac: JEL 1 Factory Interface FOUP 2 Options System Others Process Chamber (RC3 / RC4) 2 Hardware Configuration (subfab/ auxiliary units): Power Rack 1 Notes The ASM Eagle is like new. It was never used in Production and only used to test wafers. One chamber had a throttle valve issue and RF Gen issue. The RF Gen was replaced but they did not replace the throttle valve so only one chamber was used to test the wafers. The liquid gas panel was not used. There are 2 spare MFCs included. Are you in need of a high-precision, reliable tool for creating thin film coatings on your semiconductor substrates? Look no further than the 2010 ASM Eagle XP5 PEALD system! This advanced machine utilizes plasma-enhanced atomic layer deposition (PEALD) technology to create ultra-thin, uniform coatings on a variety of substrate materials. It is capable of producing coatings with exceptional uniformity and reproducibility, making it ideal for a wide range of applications in the semiconductor industry. The ASM Eagle XP5 is a versatile tool that can be used to deposit a wide range of materials, including metals, oxides, and other compounds. It is also capable of operating at a range of process pressures and temperatures, making it suitable for use in a variety of manufacturing environments. In addition to its impressive coating capabilities, the ASM Eagle XP5 is also built with durability and ease of maintenance in mind. It has a robust design and is backed by ASM's reputation for producing high-quality, reliable equipment. Don't miss out on this opportunity to add a powerful, flexible thin film coating system to your manufacturing arsenal. Purchase the 2010 ASM Eagle XP5 PEALD today and take your semiconductor production to the next level!OEM 모델 설명
Plasma enhanced atomic layer deposition문서
문서 없음