Design, development, manufacture, sales and after services of semiconductor manufacturing equipment (molding equipment, automation equipment), dies and precision parts.

Molding System

- High precision and high quality manual molding system compatible with FOWLP/FIWLP/EWLP 
- High-precision platen parallelism achieved by 4-axis linear motion motor (AYC Patented) 
- Equipped with a high-pressure 85-ton press that enables MUF molding technology 
- Resin can be supplied in liquid, granule or sheet form
- SEMI S2 compliant, SEMI S8/CE optional

YAMAHA / APIC YAMADA

WCM-330 MS

FTOR3	

CDIM	

LTM-120L

MS-150HP

FOWLP/FIWLP/eWLB compatible, high precision, high quality, fully automatic molding system
High precision platen parallelism by adopting 4-axis linear motion motor
Equipped with a high-pressure 85-ton press that enables MUF molding technology
Both liquid and granular resin can be supplied.
Abundant optional functions such as chip counting, visual inspection, post-curing, IP camera, etc.
SEMI S2 compliant, SEMI S8/CE optional
FOWLP: Fan-Out Wafer Level Package
FIWLP: Fan-In Wafer Level Package
EWLP: Embedded Wafer Level Package

WCM-330

WCM-300L

WCM-300

COMBO-300

Compact manual molding system. This system is the manual transfer molding system, designed for encapsulation of semiconductor device, versatile electronics devices, ECU for automobile etc. The system is recommended for the development work and small lot production.

YAMAHA / APIC YAMADA

개요

활성 등재물

총 제품 수

서비스

상위 제품

WCM-330 MS

FTOR3

CDIM

LTM-120L

Moov에 등재하고 즉시 완벽한 구매자를 찾으십시오.

모든 제품

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