설명
설명 없음환경 설정
Key Applications - PCB, IC Substrate, HDI, mSAP/SAP Inspection Target - Inner Layer/ Outer Layer/ Build-up / Chip Carrier Minimum Line / Space - 10 um (0.4 mil Minimum Laminate Thickness - 30 um Maximum Panel Size - 762 × 610mm (30"× 24") Panel Thickness - 25~7,500 um (1~300 mil) Weight - 900 kg Equipment Dimensions (W x D x H) - 1,610 × 1,780 × 1,860 mmOEM 모델 설명
Ultra Fusion 300 delivers leading-edge AOI performance for advanced IC substrate production down to 10μm. Featuring powerful Multi-Image Technology, the system achieves the highest level of detection accuracy and operational efficiency required for successful production of today's complex applications.문서
문서 없음
카테고리
AOI
마지막 검증일: 11일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
152851
웨이퍼 사이즈:
알 수 없음
빈티지:
2014
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KLA / ORBOTECH
ULTRA FUSION 300
카테고리
AOI
마지막 검증일: 11일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
152851
웨이퍼 사이즈:
알 수 없음
빈티지:
2014
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
Key Applications - PCB, IC Substrate, HDI, mSAP/SAP Inspection Target - Inner Layer/ Outer Layer/ Build-up / Chip Carrier Minimum Line / Space - 10 um (0.4 mil Minimum Laminate Thickness - 30 um Maximum Panel Size - 762 × 610mm (30"× 24") Panel Thickness - 25~7,500 um (1~300 mil) Weight - 900 kg Equipment Dimensions (W x D x H) - 1,610 × 1,780 × 1,860 mmOEM 모델 설명
Ultra Fusion 300 delivers leading-edge AOI performance for advanced IC substrate production down to 10μm. Featuring powerful Multi-Image Technology, the system achieves the highest level of detection accuracy and operational efficiency required for successful production of today's complex applications.문서
문서 없음