설명
SPI Parmi환경 설정
SpecOEM 모델 설명
‘Xceed MICRO’ is a precise and high speed 2D & 3D AOI machine. It is optimized for inspections required in PCB, lead-frame, FC, and SiP assembly process such as die attach, cu clip attach, underfill, solder paste and ball attach. ‘Xceed MICRO’ delivers precise 2D inspection capability and at the same time it performs high speed 3D inspections (Height, Tilt, Lift, and Volume) with its highly focused laser beam. Additionally, ‘Xceed MICRO’ is the only machine capable of inspecting foreign material/contamination and warpage on the die surface, metal lead frame, and PCB substrates simultaneously.문서
문서 없음
PARMI
XCEED MICRO
검증됨
카테고리
AOI
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
99699
웨이퍼 사이즈:
알 수 없음
빈티지:
2021
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PARMI
XCEED MICRO
카테고리
AOI
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
99699
웨이퍼 사이즈:
알 수 없음
빈티지:
2021
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
SPI Parmi환경 설정
SpecOEM 모델 설명
‘Xceed MICRO’ is a precise and high speed 2D & 3D AOI machine. It is optimized for inspections required in PCB, lead-frame, FC, and SiP assembly process such as die attach, cu clip attach, underfill, solder paste and ball attach. ‘Xceed MICRO’ delivers precise 2D inspection capability and at the same time it performs high speed 3D inspections (Height, Tilt, Lift, and Volume) with its highly focused laser beam. Additionally, ‘Xceed MICRO’ is the only machine capable of inspecting foreign material/contamination and warpage on the die surface, metal lead frame, and PCB substrates simultaneously.문서
문서 없음