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ULVAC NA-8000
  • ULVAC NA-8000
  • ULVAC NA-8000
  • ULVAC NA-8000
설명
NA 8000 Ashing
환경 설정
환경 설정 없음
OEM 모델 설명
The NA-8000 is a versatile ashing system that can remove anything from organic film to oxide film to SiN. It has a high dose ion implant stripping process and polymer removal process of 10E + 16 or higher level, necessary for critical processes for next-generation wafers. The chamber construction is arranged most suitably for an F-based gas addition process, allowing for particle-free treatment. The system construction is simple, achieving excellent maintainability and reliability, and low cost at the same time. It also allows for flexible system construction (μ wave, RIE, and μ wave + RIE) and easy wafer size change by simply changing the recipe setting. Overall, the NA-8000 is a powerful tool for removing anything and everything from your wafers.
문서

문서 없음

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검증됨

카테고리
Ashers / Plasma Cleaner

마지막 검증일: 60일 이상 전

주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

72903


웨이퍼 사이즈:

알 수 없음


빈티지:

알 수 없음


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

ULVAC

NA-8000

verified-listing-icon
검증됨
카테고리
Ashers / Plasma Cleaner
마지막 검증일: 60일 이상 전
listing-photo-7e8fa06c83af48a1859661431b0abac0-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

72903


웨이퍼 사이즈:

알 수 없음


빈티지:

알 수 없음


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
NA 8000 Ashing
환경 설정
환경 설정 없음
OEM 모델 설명
The NA-8000 is a versatile ashing system that can remove anything from organic film to oxide film to SiN. It has a high dose ion implant stripping process and polymer removal process of 10E + 16 or higher level, necessary for critical processes for next-generation wafers. The chamber construction is arranged most suitably for an F-based gas addition process, allowing for particle-free treatment. The system construction is simple, achieving excellent maintainability and reliability, and low cost at the same time. It also allows for flexible system construction (μ wave, RIE, and μ wave + RIE) and easy wafer size change by simply changing the recipe setting. Overall, the NA-8000 is a powerful tool for removing anything and everything from your wafers.
문서

문서 없음