설명
Semi-automatic Thermal Slide De-Bonder Thermal slide-off debonding Bottom IR lamp heating Chuck sizes: 8 inch Suitable for temporary bonded wafer stacks Recipe-controlled process Real-time process monitoring/logging (force, temperature, and position) 8 inch end effector available환경 설정
환경 설정 없음OEM 모델 설명
The EVG805 is a semi-automated system for debonding of temporary bonded and processed wafer stacks consisting of a device wafer, carrier wafer and an intermediate temporary bonding adhesive. The tool either supports thermal or mechanical debonding. The thin wafer can be unloaded on a single substrate carrier for safe and reliable transport between tools.문서
문서 없음
카테고리
Bonder/Debonder
마지막 검증일: 7일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
144932
웨이퍼 사이즈:
8"/200mm
빈티지:
2010
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG805
카테고리
Bonder/Debonder
마지막 검증일: 7일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
144932
웨이퍼 사이즈:
8"/200mm
빈티지:
2010
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Semi-automatic Thermal Slide De-Bonder Thermal slide-off debonding Bottom IR lamp heating Chuck sizes: 8 inch Suitable for temporary bonded wafer stacks Recipe-controlled process Real-time process monitoring/logging (force, temperature, and position) 8 inch end effector available환경 설정
환경 설정 없음OEM 모델 설명
The EVG805 is a semi-automated system for debonding of temporary bonded and processed wafer stacks consisting of a device wafer, carrier wafer and an intermediate temporary bonding adhesive. The tool either supports thermal or mechanical debonding. The thin wafer can be unloaded on a single substrate carrier for safe and reliable transport between tools.문서
문서 없음