설명
3D14 TEL SYNAPSE V BONDER BOND3환경 설정
환경 설정 없음OEM 모델 설명
Synapse™ V is a 300mm wafer bonder/debonder system which enable temporary bonding or debonding process efficiently. As the continuation of Moore’s law is becoming more and more challenging, 3D-IC with through-silicon via (TSV) interconnects secure a firm position in the field of advanced semiconductor, attracting attention as a means to improve semiconductor performance. Synapse™ V is a temporary wafer bonding system, which allows two wafers to be bonded together by using various adhesives. The system consists of material coating, baking, and bonding functions to realize integrated wafer bonding processes in a single tool. Uniquely developed wafer alignment unit and wafer bonding module provide the highest level of Total Thickness Variation (TTV) and bonding accuracy. Temporary bonder system, capable of coating, baking and bonding in one tool.문서
문서 없음
TEL / TOKYO ELECTRON
SYNAPSE V
검증됨
카테고리
Bonder/Debonder
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
113005
웨이퍼 사이즈:
12"/300mm
빈티지:
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
TEL / TOKYO ELECTRON
SYNAPSE V
카테고리
Bonder/Debonder
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
113005
웨이퍼 사이즈:
12"/300mm
빈티지:
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
3D14 TEL SYNAPSE V BONDER BOND3환경 설정
환경 설정 없음OEM 모델 설명
Synapse™ V is a 300mm wafer bonder/debonder system which enable temporary bonding or debonding process efficiently. As the continuation of Moore’s law is becoming more and more challenging, 3D-IC with through-silicon via (TSV) interconnects secure a firm position in the field of advanced semiconductor, attracting attention as a means to improve semiconductor performance. Synapse™ V is a temporary wafer bonding system, which allows two wafers to be bonded together by using various adhesives. The system consists of material coating, baking, and bonding functions to realize integrated wafer bonding processes in a single tool. Uniquely developed wafer alignment unit and wafer bonding module provide the highest level of Total Thickness Variation (TTV) and bonding accuracy. Temporary bonder system, capable of coating, baking and bonding in one tool.문서
문서 없음