설명
설명 없음환경 설정
Modules: -Carrier Station Block (CSB): -Carrier station block Robotic Arm (CRA) -Gang Air Bonding Block (GAB): -Gang Air Bonding Press Module (GANG) -Gang Air Robotic Arm (GARA) -Notch Alignment Module (NAM) -Transition Stage (TRS) -Slim Chill Plate Process Station War page Wafer Leveling (SCPW) -Breaker electrical Box -FOUP Type Loading Gang bonder comes as 3 modules: -CSB (Main body) -GAB (Main body) -Booster pump (External utility)OEM 모델 설명
미제공문서
문서 없음
TEL / TOKYO ELECTRON
SYNAPSE
검증됨
카테고리
Bonder/Debonder
마지막 검증일: 13일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
44844
웨이퍼 사이즈:
12"/300mm
빈티지:
2015
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
TEL / TOKYO ELECTRON
SYNAPSE
카테고리
Bonder/Debonder
마지막 검증일: 13일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
44844
웨이퍼 사이즈:
12"/300mm
빈티지:
2015
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
Modules: -Carrier Station Block (CSB): -Carrier station block Robotic Arm (CRA) -Gang Air Bonding Block (GAB): -Gang Air Bonding Press Module (GANG) -Gang Air Robotic Arm (GARA) -Notch Alignment Module (NAM) -Transition Stage (TRS) -Slim Chill Plate Process Station War page Wafer Leveling (SCPW) -Breaker electrical Box -FOUP Type Loading Gang bonder comes as 3 modules: -CSB (Main body) -GAB (Main body) -Booster pump (External utility)OEM 모델 설명
미제공문서
문서 없음