EAGLE XTREME
카테고리
Bonders개요
The ASMPT EAGLE XTREME is an advanced semiconductor die bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME is designed to provide high-precision die bonding capabilities for semiconductor manufacturing processes.
활성 등재물
20
서비스
검사, 보험, 감정, 물류
