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설명
WIREBONDER환경 설정
환경 설정 없음OEM 모델 설명
The ASMPT EAGLE XTREME is an advanced semiconductor die bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME is designed to provide high-precision die bonding capabilities for semiconductor manufacturing processes.문서
문서 없음
PREFERRED
SELLER
카테고리
Wire / Wedge / Ball Bonder
마지막 검증일: 60일 이상 전
Buyer pays 12% premium of final sale price
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
33289
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
PREFERRED
SELLER
ASM
EAGLE XTREME
카테고리
Wire / Wedge / Ball Bonder
마지막 검증일: 60일 이상 전
Buyer pays 12% premium of final sale price
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
33289
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
WIREBONDER환경 설정
환경 설정 없음OEM 모델 설명
The ASMPT EAGLE XTREME is an advanced semiconductor die bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME is designed to provide high-precision die bonding capabilities for semiconductor manufacturing processes.문서
문서 없음