설명
Functional and placed in an air-conditioned cleanroom environment from new.환경 설정
환경 설정 없음OEM 모델 설명
The ASM Eagle Xpress Gocu is a type of ball bonder used in the semiconductor industry. The power requirements for the ASM Eagle Xpress Gocu are 220 V, 7.2 A, 50/60 Hz, 1 Phase. A ball bonder is a type of semiconductor assembly equipment used for wire bonding. It is capable of ball bumping and customized looping profiles.문서
문서 없음
ASM
EAGLE XPRESS GOCU
검증됨
카테고리
Bonders
주요 품목 세부 정보
조건:
Used
작동 상태:
Installed / Idle
제품 ID:
90818
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기ASM
EAGLE XPRESS GOCU
검증됨
카테고리
Bonders
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Installed / Idle
제품 ID:
90818
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Functional and placed in an air-conditioned cleanroom environment from new.환경 설정
환경 설정 없음OEM 모델 설명
The ASM Eagle Xpress Gocu is a type of ball bonder used in the semiconductor industry. The power requirements for the ASM Eagle Xpress Gocu are 220 V, 7.2 A, 50/60 Hz, 1 Phase. A ball bonder is a type of semiconductor assembly equipment used for wire bonding. It is capable of ball bumping and customized looping profiles.문서
문서 없음