2100 FC
카테고리
Bonders개요
The Flip Chip Bonder Esec 2100 FC hS capable of running an extensive range of FC applications such as FCOL, FC‑MIS, FC‑SIP, FCCSP, FCBGA as well as emerging packages such as CSP-LED.
활성 등재물
3
서비스
검사, 보험, 감정, 물류
The Flip Chip Bonder Esec 2100 FC hS capable of running an extensive range of FC applications such as FCOL, FC‑MIS, FC‑SIP, FCCSP, FCBGA as well as emerging packages such as CSP-LED.
3
검사, 보험, 감정, 물류
