설명
설명 없음환경 설정
- rotating table for P&P-tools (ok) - wafer- + substrate cameras (ok) - wafer exchanger (ok) - entry line (ok – one transport) - output line (ok - rolls) - 1 module / bondhead - has a slight tilting after a crash, still operating and we used it with an offset adjustment. - cross hair glass plate missing - wafer illumination does not work (external light used)OEM 모델 설명
The Datacon PPS 2210 is a multi-chip die bonder used for attaching chips to a substrate.문서
문서 없음
BESI / DATACON
PPS 2210
검증됨
카테고리
Bonders
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
26412
웨이퍼 사이즈:
6"/150mm, 8"/200mm
빈티지:
1997
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Logistics Support
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Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / DATACON
PPS 2210
검증됨
카테고리
Bonders
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
26412
웨이퍼 사이즈:
6"/150mm, 8"/200mm
빈티지:
1997
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
- rotating table for P&P-tools (ok) - wafer- + substrate cameras (ok) - wafer exchanger (ok) - entry line (ok – one transport) - output line (ok - rolls) - 1 module / bondhead - has a slight tilting after a crash, still operating and we used it with an offset adjustment. - cross hair glass plate missing - wafer illumination does not work (external light used)OEM 모델 설명
The Datacon PPS 2210 is a multi-chip die bonder used for attaching chips to a substrate.문서
문서 없음