설명
설명 없음환경 설정
-Unit setup for thermal bonding and hot embossing. -Windows 2000 -Unit setup for thermal bonding, not anodic bonding. -Will need to hook it to a three phase power source and compressed air/ nitrogen. -Fully operational -Last used in 2019OEM 모델 설명
The EVG520 HE is a cutting-edge semi-automated hot embossing system, specifically tailored for high-precision thermoplastic substrate imprinting. Capable of accommodating substrates up to 200 mm in diameter, it seamlessly integrates with industry-standard semiconductor manufacturing technologies. The system features high-vacuum and high-contact force capabilities, along with a universal embossing chamber, ensuring efficient and reliable processing. Its versatility allows for working with a comprehensive range of polymers suitable for hot embossing applications, making it an ideal choice for advanced manufacturing needs.문서
EVGroup (EVG)
EVG520 HE
검증됨
카테고리
Bonders
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
55796
웨이퍼 사이즈:
8"/200mm
빈티지:
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG520 HE
카테고리
Bonders
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
55796
웨이퍼 사이즈:
8"/200mm
빈티지:
2005
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available