설명
Details attached.환경 설정
10kN Force, Max Temp 500°COEM 모델 설명
The EVG520-IS is a semi-automated wafer bonding system developed by EV Group (EVG). It is designed to handle wafers up to 200 mm in size, making it suitable for small-volume-production applications. The system's design has been improved based on customer feedback and EV Group's continuous technological innovations. One of its key features is the proprietary symmetric rapid heating and cooling chuck design, which ensures efficient and precise bonding processes. The EVG520-IS offers independent top- and bottom-side heaters, enabling high-pressure bonding capability and providing excellent material and process flexibility.문서
EVGroup (EVG)
EVG520IS
검증됨
카테고리
Bonders
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Refurbished
작동 상태:
알 수 없음
제품 ID:
14447
웨이퍼 사이즈:
8"/200mm
빈티지:
2007
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기EVGroup (EVG)
EVG520IS
카테고리
Bonders
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Refurbished
작동 상태:
알 수 없음
제품 ID:
14447
웨이퍼 사이즈:
8"/200mm
빈티지:
2007
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available