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The EVG®510 is a semi-automated wafer bonding system that is versatile and quick to adapt. It can accommodate various substrate sizes, ranging from pieces to 200 mm. It is compatible with all standard wafer bonding processes, including anodic, glass frit, solder, eutectic, transient liquid phase, and direct. Its design allows for swift retooling for different wafer sizes and processes, with a conversion time of less than 5 minutes.문서
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EVGroup (EVG)
EVG510
검증됨
카테고리
Bonders
마지막 검증일: 28일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
102964
웨이퍼 사이즈:
12"/300mm
빈티지:
2023
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG510
카테고리
Bonders
마지막 검증일: 28일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
102964
웨이퍼 사이즈:
12"/300mm
빈티지:
2023
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The EVG®510 is a semi-automated wafer bonding system that is versatile and quick to adapt. It can accommodate various substrate sizes, ranging from pieces to 200 mm. It is compatible with all standard wafer bonding processes, including anodic, glass frit, solder, eutectic, transient liquid phase, and direct. Its design allows for swift retooling for different wafer sizes and processes, with a conversion time of less than 5 minutes.문서
문서 없음