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KULICKE & SOFFA (K&S) 6496

설명

Semiautomatic Flip Chip Die Bonder ±1.2 Mil @ 3 Sigma Placement Accuracy 50 to 3000 grams Bond Force Range 10sq. mil – 1000sq.mil Die Size Range 19” X 12” XY Stage Travel; 0.5”Z Axis Travel; 0.0003” (0.0076 mm) X, Y, Z Resolution 0.2 mrad/motor pulse Theta Rotation

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OEM 모델 설명

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문서

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KULICKE & SOFFA (K&S)

6496

verified-listing-icon

검증됨

카테고리

Bonders

마지막 검증일: 60일 이상 전

주요 품목 세부 정보

조건:

Used

작동 상태:

알 수 없음

제품 ID:

21401

웨이퍼 사이즈:

알 수 없음

빈티지:

알 수 없음

Have Additional Questions?

Logistics Support

Available

Money Back Guarantee

Available

Transaction Insured by Moov

Available

Refurbishment Services

Available

유사 등재물

KULICKE & SOFFA (K&S) 6496

KULICKE & SOFFA (K&S)

6496

빈티지: 0조건: 중고

마지막 검증일60일 이상 전

KULICKE & SOFFA (K&S) 6496

KULICKE & SOFFA (K&S)

6496

빈티지: 0조건: 중고

마지막 검증일60일 이상 전

KULICKE & SOFFA (K&S) 6496

KULICKE & SOFFA (K&S)

6496

빈티지: 1994조건: 중고

마지막 검증일60일 이상 전

KULICKE & SOFFA (K&S)

6496

verified-listing-icon

검증됨

카테고리

Bonders

마지막 검증일: 60일 이상 전

listing-photo-TgYj0qmai7Qo2xoeJf6CdztLKBTMHRtJRAPtB5fAhXs-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/Ot4uSyt7j-OkIRBJeE4orTieeZmN71mOLX5X1zTe7fk/TgYj0qmai7Qo2xoeJf6CdztLKBTMHRtJRAPtB5fAhXs/kJS2AE26pojpR8rMcLJqAkOuJsA697BY35_D6DykOWc_20190315_091852_f

listing-photo-TgYj0qmai7Qo2xoeJf6CdztLKBTMHRtJRAPtB5fAhXs-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/Ot4uSyt7j-OkIRBJeE4orTieeZmN71mOLX5X1zTe7fk/TgYj0qmai7Qo2xoeJf6CdztLKBTMHRtJRAPtB5fAhXs/c5UqCB0NqbVmULgPq9pUFtBMKAfUYnxixkDpMNk6U30_20190315_091853_f

listing-photo-TgYj0qmai7Qo2xoeJf6CdztLKBTMHRtJRAPtB5fAhXs-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/Ot4uSyt7j-OkIRBJeE4orTieeZmN71mOLX5X1zTe7fk/TgYj0qmai7Qo2xoeJf6CdztLKBTMHRtJRAPtB5fAhXs/MSuQ0k0xpguUxFu_673t3WOA0pedoom-T1zm6ByZMQg_20190315_091853_f

listing-photo-TgYj0qmai7Qo2xoeJf6CdztLKBTMHRtJRAPtB5fAhXs-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/Ot4uSyt7j-OkIRBJeE4orTieeZmN71mOLX5X1zTe7fk/TgYj0qmai7Qo2xoeJf6CdztLKBTMHRtJRAPtB5fAhXs/wxoGfKd2h4pFB5iFNhZXPRrMmBRrVV42LzJHdrv66Xo_20190315_091853_f

listing-photo-TgYj0qmai7Qo2xoeJf6CdztLKBTMHRtJRAPtB5fAhXs-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/Ot4uSyt7j-OkIRBJeE4orTieeZmN71mOLX5X1zTe7fk/TgYj0qmai7Qo2xoeJf6CdztLKBTMHRtJRAPtB5fAhXs/sTAcZcAw-rS1fT_NOjV2jlexb4RRlC0eyslyWbFAw-Y_20190315_091853_f

listing-photo-TgYj0qmai7Qo2xoeJf6CdztLKBTMHRtJRAPtB5fAhXs-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/Ot4uSyt7j-OkIRBJeE4orTieeZmN71mOLX5X1zTe7fk/TgYj0qmai7Qo2xoeJf6CdztLKBTMHRtJRAPtB5fAhXs/3nSGDEaKTBt41ovPnaYD8eO7qNo3kHYCOWFocOo85DQ_20190315_091853_f

listing-photo-TgYj0qmai7Qo2xoeJf6CdztLKBTMHRtJRAPtB5fAhXs-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/Ot4uSyt7j-OkIRBJeE4orTieeZmN71mOLX5X1zTe7fk/TgYj0qmai7Qo2xoeJf6CdztLKBTMHRtJRAPtB5fAhXs/83CjsZ5RLcDmUtBH4HD2jFrOiVCWTX9eaeoRBIbqdsc_20190315_091853_f

주요 품목 세부 정보

조건:

Used

작동 상태:

알 수 없음

제품 ID:

21401

웨이퍼 사이즈:

알 수 없음

빈티지:

알 수 없음

Logistics Support

Available

Money Back Guarantee

Available

Transaction Insured by Moov

Available

Refurbishment Services

Available

설명

Semiautomatic Flip Chip Die Bonder ±1.2 Mil @ 3 Sigma Placement Accuracy 50 to 3000 grams Bond Force Range 10sq. mil – 1000sq.mil Die Size Range 19” X 12” XY Stage Travel; 0.5”Z Axis Travel; 0.0003” (0.0076 mm) X, Y, Z Resolution 0.2 mrad/motor pulse Theta Rotation

환경 설정

환경 설정 없음

OEM 모델 설명

미제공

문서

문서 없음

유사 등재물

KULICKE & SOFFA (K&S) 6496

KULICKE & SOFFA (K&S)

6496

Bonders빈티지: 0조건: 중고마지막 검증일: 60일 이상 전

KULICKE & SOFFA (K&S) 6496

KULICKE & SOFFA (K&S)

6496

Bonders빈티지: 0조건: 중고마지막 검증일: 60일 이상 전

KULICKE & SOFFA (K&S) 6496

KULICKE & SOFFA (K&S)

6496

Bonders빈티지: 1994조건: 중고마지막 검증일: 60일 이상 전