설명
설명 없음환경 설정
-Unit is in a 505 Chassis. Has the accuracy and software of a 605.OEM 모델 설명
Newport MRSI-605 AP Advanced Packaging Die Bonder, the ultimate solution for cutting-edge assembly needs in the semiconductor and electronic packaging markets. This advanced system offers unparalleled capabilities, catering to epoxy die attach, eutectic, and flip chip bonding, empowering manufacturers of MEMS, semiconductor packages, multi-chip modules, military and defense hybrids, microwave and RF circuits, and photonics packages.문서
문서 없음
NEWPORT
MRSI 605
검증됨
카테고리
Bonders
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
44355
웨이퍼 사이즈:
알 수 없음
빈티지:
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
NEWPORT
MRSI 605
카테고리
Bonders
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
44355
웨이퍼 사이즈:
알 수 없음
빈티지:
2001
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
-Unit is in a 505 Chassis. Has the accuracy and software of a 605.OEM 모델 설명
Newport MRSI-605 AP Advanced Packaging Die Bonder, the ultimate solution for cutting-edge assembly needs in the semiconductor and electronic packaging markets. This advanced system offers unparalleled capabilities, catering to epoxy die attach, eutectic, and flip chip bonding, empowering manufacturers of MEMS, semiconductor packages, multi-chip modules, military and defense hybrids, microwave and RF circuits, and photonics packages.문서
문서 없음