설명
Applications: This system bonds a product substrate and product chips with high-pressure air and high-temperature heart for IC development and manufacturing. This system is generally called a permanent bonder.환경 설정
- System Configuration: This system consist of wafer processing equipment and a peripheral device (air booster) that supplies high-pressure air. - Equipment Configuration: The equipment consist of two types of blocks: Carrier Station Block (CSB) and Gang Air Bonding Block (GAB).OEM 모델 설명
미제공문서
문서 없음
TEL / TOKYO ELECTRON
SYNAPSE
검증됨
카테고리
Bonders
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
44844
웨이퍼 사이즈:
12"/300mm
빈티지:
2015
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
TEL / TOKYO ELECTRON
SYNAPSE
검증됨
카테고리
Bonders
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
44844
웨이퍼 사이즈:
12"/300mm
빈티지:
2015
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Applications: This system bonds a product substrate and product chips with high-pressure air and high-temperature heart for IC development and manufacturing. This system is generally called a permanent bonder.환경 설정
- System Configuration: This system consist of wafer processing equipment and a peripheral device (air booster) that supplies high-pressure air. - Equipment Configuration: The equipment consist of two types of blocks: Carrier Station Block (CSB) and Gang Air Bonding Block (GAB).OEM 모델 설명
미제공문서
문서 없음