설명
OXIDE환경 설정
MIRRA 3400OEM 모델 설명
The Mirra® is a state-of-the-art CMP system that offers a flexible platform for process development and efficient manufacturing. Its unique four-head/three-platen design and advanced features such as the Titan Head™ wafer polishing carrier and the In-situ Rate Monitor™ (ISRM™) offer superior process control and flexibility while enabling system throughput of more than 50 wafers per hour. The Titan Head delivers consistent world-class within-wafer uniformity and repeatability with minimum edge exclusion over a wide range of process conditions. The ISRM detects film thickness changes during polishing, for highly accurate, real-time process control that allows the user to precisely define material removal and thus, process endpoint. The Mirra system is the answer for the full range of emerging CMP requirements, including compatibility with different cleaning systems and factory-automated buffering.문서
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APPLIED MATERIALS (AMAT)
MIRRA
검증됨
카테고리
CMP
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
90543
웨이퍼 사이즈:
8"/200mm
빈티지:
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
APPLIED MATERIALS (AMAT)
MIRRA
카테고리
CMP
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
90543
웨이퍼 사이즈:
8"/200mm
빈티지:
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
OXIDE환경 설정
MIRRA 3400OEM 모델 설명
The Mirra® is a state-of-the-art CMP system that offers a flexible platform for process development and efficient manufacturing. Its unique four-head/three-platen design and advanced features such as the Titan Head™ wafer polishing carrier and the In-situ Rate Monitor™ (ISRM™) offer superior process control and flexibility while enabling system throughput of more than 50 wafers per hour. The Titan Head delivers consistent world-class within-wafer uniformity and repeatability with minimum edge exclusion over a wide range of process conditions. The ISRM detects film thickness changes during polishing, for highly accurate, real-time process control that allows the user to precisely define material removal and thus, process endpoint. The Mirra system is the answer for the full range of emerging CMP requirements, including compatibility with different cleaning systems and factory-automated buffering.문서
문서 없음