설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
EBARA's CMP system Model F-REX is Chemical Mechanical Polishing system that enables nanometer level planarity (10~20nm on 300mm wafer) in semiconductor manufacturing process. Ebara's CMP system, Model F-REX200M2 and F-REX300X has achieved both an advanced process performance and high productivity. This is made possible with "1-head per 1-table" unique architecture processing an individual wafer delicately while the "4 table platform" enables high throughput.문서
문서 없음
EBARA
F-REX300X
검증됨
카테고리
CMP
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
82435
웨이퍼 사이즈:
12"/300mm
빈티지:
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EBARA
F-REX300X
카테고리
CMP
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
82435
웨이퍼 사이즈:
12"/300mm
빈티지:
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
EBARA's CMP system Model F-REX is Chemical Mechanical Polishing system that enables nanometer level planarity (10~20nm on 300mm wafer) in semiconductor manufacturing process. Ebara's CMP system, Model F-REX200M2 and F-REX300X has achieved both an advanced process performance and high productivity. This is made possible with "1-head per 1-table" unique architecture processing an individual wafer delicately while the "4 table platform" enables high throughput.문서
문서 없음