설명
Multi-Process CMP환경 설정
환경 설정 없음OEM 모델 설명
MOMENTUM is a high-throughput, dry-in/dry-out CMP system for all 200mm-wafer process applications. Designed with extendibility to accommodate future reductions in line widths, the MOMENTUM has four independent wafer-polishing platens that allow for maximum manufacturing flexibility. It also employs a patented orbital polishing motion that minimizes surface dishing and erosion and a slurry delivery system that results in more efficient consumption of polishing chemicals.문서
문서 없음
카테고리
CMP
마지막 검증일: 19일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
147704
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
NOVELLUS / SpeedFam-IPEC
MOMENTUM
카테고리
CMP
마지막 검증일: 19일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
147704
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Multi-Process CMP환경 설정
환경 설정 없음OEM 모델 설명
MOMENTUM is a high-throughput, dry-in/dry-out CMP system for all 200mm-wafer process applications. Designed with extendibility to accommodate future reductions in line widths, the MOMENTUM has four independent wafer-polishing platens that allow for maximum manufacturing flexibility. It also employs a patented orbital polishing motion that minimizes surface dishing and erosion and a slurry delivery system that results in more efficient consumption of polishing chemicals.문서
문서 없음