설명
Litho환경 설정
-COATER CUP – 2X -DEVELOPER CUPS – 2X -Running condition Model: 200AA129 - Genmark Gencobot 8/3L Handler - Thermo Scientific A40 Chiller with PC 200 Immersion Circulator - Module 1: Spinner Module - Module 2: Filler Module - Module 3: HCV Module - Module 4: Spinner ModuleOEM 모델 설명
The SUSS ACS200 Gen3 platform is the successful result of a perfect mix of innovative and production proven components. With the capability of up to 4 wet process modules and a maximum of 19 plates it perfectly suits the needs of high volume manufacturing (HVM). The unmatched configuration flexibility of modules and technologies covers not only the requirements of the Advanced Packaging, MEMS and LED market it also bridges the gap between R&D and HVM.문서
문서 없음
SUSS MicroTec / KARL SUSS
ACS200 Gen3
검증됨
카테고리
Coaters & Developers
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Installed / Idle
제품 ID:
111541
웨이퍼 사이즈:
알 수 없음
빈티지:
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
SUSS MicroTec / KARL SUSS
ACS200 Gen3
카테고리
Coaters & Developers
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Installed / Idle
제품 ID:
111541
웨이퍼 사이즈:
알 수 없음
빈티지:
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Litho환경 설정
-COATER CUP – 2X -DEVELOPER CUPS – 2X -Running condition Model: 200AA129 - Genmark Gencobot 8/3L Handler - Thermo Scientific A40 Chiller with PC 200 Immersion Circulator - Module 1: Spinner Module - Module 2: Filler Module - Module 3: HCV Module - Module 4: Spinner ModuleOEM 모델 설명
The SUSS ACS200 Gen3 platform is the successful result of a perfect mix of innovative and production proven components. With the capability of up to 4 wet process modules and a maximum of 19 plates it perfectly suits the needs of high volume manufacturing (HVM). The unmatched configuration flexibility of modules and technologies covers not only the requirements of the Advanced Packaging, MEMS and LED market it also bridges the gap between R&D and HVM.문서
문서 없음